March 17 (Reuters) – The founder of Huawei Technologies Co Ltd ( HVT.UL ) stated the firm has replaced extra than 13,000 components in its solutions that have been hit by U.S. trade sanctions, according to a transcript of the speech released by a Chinese university on Friday.

According to a transcript published by Shanghai Jiao Tong University, Huawei founder Ren Zhengfei stated that in the previous 3 years, Huawei has replaced 13,000 elements with domestic Chinese substitutes and redesigned four,000 circuit boards for its solutions. He stated that the production of printed circuit boards “stabilized”.

The remarks, which Reuters could not independently confirm, offered a window into Huawei’s efforts to bounce back from US trade restrictions. Given that 2019, Huawei, a main supplier of gear employed in 5G telecommunications networks, has been the target of successive rounds of US export controls.

These controls reduce off Huawei’s provide of chips from US providers and access to US technologies tools to style its personal chips and have them manufactured by partners. The Biden administration also banned the sale of new Huawei gear in the US final year

Ren stated this in a conversation with Chinese technologies professionals on February 24, the university stated. The university posted the transcript on its web page on Friday. A representative for U.S.-primarily based Huawei did not instantly respond to a request for comment on Friday.

Ren stated Huawei has invested $23.eight billion in R&D in 2022 and “as our profitability improves, we will continue to boost our R&D spending.”

The reports come just after analysts stated Huawei showed off 5G telecommunications gear at an sector conference in Barcelona exactly where the origins of all the chips on its circuit boards have been obscured.

Reporting by Stephen Nellis in San Francisco and Crystal Hu in New York Editing by Cynthia Osterman

Our Requirements: Thomson Reuters Trust Principles.

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