Intel announced on Wednesday that its 3nm-class process technology, Intel 3, has begun high-volume production at two locations. This new production node offers higher performance and transistor density, supporting voltages of 1.2 V for ultra-high performance applications.
The Intel 3 manufacturing process is focused on data center applications that demand peak performance. The technology features refurbished transistors, reduced transistor over resistance in the power delivery circuit and design co-optimization. The production node supports both low and high voltage for maximum loads, promising 18% higher performance at the same power and transistor density compared to Intel 4.
Walid Hafez, vice president of foundry technology development at Intel, spoke about the new production node during a press conference. He said that “Our Intel 3 is being produced in high volume at our factories in Oregon and Ireland, including the recently launched Xeon 6 ‘Sierra Forest’ and ‘Granite Rapids’ processors.”
To achieve the best combination of performance and density, chip designers will need to use a mix of high-performance and high-density libraries. Clients can choose from a variety of metal stack options to suit their needs. Initially, the 3nm class process technology will be used to produce Xeon 6 data center processors, with plans to expand to consumer data center level processors in the future.
In addition to its focus on data center applications, Intel is also committed to providing a range of options for different applications and performance needs. The company is offering variations of Intel 3 technology