Alchip Technologies, founded in 2003 and headquartered in Taipei, Taiwan, is a leading provider of high-performance ASICs. They recently showcased their achievements and future direction at the TSMC 2024 North American Technology Symposium in Santa Clara, California, and a workshop in Austin, Texas.
At their booth, Alchip highlighted their expertise in advanced chiplet technology and design plans. They discussed their success with complex projects, including full wire size designs over 800mm² on state-of-the-art FinFET technology. Alchip engineers also showcased their advanced package manufacturing capabilities, such as CoVoS® designs at advanced nodes, power levels over 1000V and packages larger than 70x80mm2 currently in production.
Alchip is known for providing silicon design and manufacturing services for system companies developing complex ASICs and high-volume SoCs. They offer faster time-to-market and cost-effective solutions for SoC design across a variety of process technologies. The company has strong industry partnerships, including their membership in the TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and the 3DFabricTM Alliance.
In addition to the symposiums in Santa Clara and Austin, Alchip will also participate in TSMC NA technology workshops in Boston, MA, and technology symposia in Europe, Taiwan, China and Japan. For more information about Alchip Technologies or to contact them directly with further questions, visit www.alchip.com or contact Charles Biers at (408)-310-9244 or chuck\_biers@alchip.com